The ADM-VA600 is a 6U Space VPX reference platform for the AMD Versal AI Core XQRVC1902 Adaptable SoC platform for Space 2.0.

Versal AI Core provides a massive leap forward in reconfigurable and customizable processing performance for Space mission deployment of compute intensive applications such as Signal Processing and Machine Learning. The platform is designed to accept components suitable for Space 2.0 level missions with limited radiation environment or mission length, such as LEO applications. The standard manufacturing build of this platform is however intended for laboratory prototyping use only with commercial footprint compatible parts and unqualified space parts fitted in most cases.

The primary customers will be using this version for design proving and other prototype level testing. Custom manufacture of the board with qualified space plastic parts, and possible application specific customizations is available as an option to customers.

The board features a reference Space Grade power supply co-designed with Texas Instruments, along with many other Space Enhanced Plastic devices covering clocking and system monitoring functionality. The board also features Space Grade DDR4 Memory modules from Teledyne e2v.

See the ADK-VA600 page for the complete system overview.


COTS Development Platform for Space 2.0
Prototype for Space Grade Systems

Board Features

Versal VC1902 Adaptive SoC for Space 2.0
6U Space VPX form factor with 20x 10G HSSIO
24x 32G HSSIO via FMC+ Interface
2x Teledyne e2v Space Grade DDR4 Memory Banks (8GB pre bank; 16GB total)
Reference Power Supply using radiation tolerant SEP grade parts from TI (core 0.8V supply limited at commercial grade)
Reference TI SEP clocking and IO buffering design
TI MSP430 System Monitoring SEP microcontroller

FPGA Features (Hard IP)

400x AI Engine Tiles
2x ARM Cortex-A72 MPCore™
2x ARM Cortex-R5 MPCore
4x PCI Express Gen3 cores


Board Format

6U VPX (233mm x 160mm x 12.5mm)
Width: 233mm
Height: 12.5mm
Depth: 160mm
Weight: TBDg

Environmental Specifications

Temperature Limits
Operating Temperature RangeStorage Temperature Range
AC0Air Cooled Commercial0°C+55°C-40°C+85°C

Operating Humidity Range:
Up to 95% (non-condensing)


Host I/F


Target Device

AMD Versal AI Core
XCVC1902-1MSIVSVA2197 (default) (option)

FPGA Resources

XCVC1902-1MSIVSVA2197 (default)899K196834Mb130Mb

FPGA Hard IP Cores

400x AI Engine Tiles
2x ARM Cortex-A72 MPCore™
2x ARM Cortex-R5 MPCore
4x PCI Express Gen3 cores

On Board Memory

Memory TypeNo. BanksMemory Size (per bank)
MCP28GB (1G @ 72bits wide) DDR4

Target FPGA Configuration

Via QSPI Flash uSD and via JTAG

FPGA Configuration Flash

Flash TypeFlash Size
QSPI - Flash on Module2Gb

I/O Interfaces

Interface TypeQtyDescription
FMC+ HSSIO2424x HSSIO up to 32G via FMC+ module: Configurable for JESD204B; JESD204C; 10/40/100G Ethernet; SpaceFibre etc.
VPX HSSIO2020x HSSIO up to 10G via VPX Backplane: Configurable for 10/40G Ethernet; SpaceFibre; PCIe; RIO; Aurora; HSDP etc.
VPX I2C1I2C for System Monitor
VPX JTAG1JTAG for System Monitoring, configuration and testing
VPX Ethernet11G Ethernet Interface on VPX for Versal access and management
VPX Low Speed IO1UART and CAN bus access
VPX GPIO1Custom GPIO breakout to backplane
VPX SMAP1SMAP to allow configuration options from external card in VPX system

Ordering Information

Ordering Code
ParameterCodeParameter Description
Platform TypeT/DEV - ADM-VA600/DEV - with XCVC1902 fitted, purchasable as part of ADK-VA600 Development Kit


App Note AD-AN-0142: AD-AN-0142 - ADM-VA600 Board File Information

App Note AD-AN-0143: AD-AN-0143 - Implementing a CPM4 PCI Express Interface in the ADM-VA600

App Note AD-AN-0144: AD-AN-0144 - Implementing a DDR4 SDRAM Interface in the ADM-VA600


Please visit the ADK-VA600 product page for details on resources supplied for the ADM-VA600.

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