ADM-VA600

Summary

The ADM-VA600 is a 6U Space VPX reference platform for the AMD-Xilinx Versal AI Core XQRVC1902 Adaptable SoC platform for Space 2.0.

Versal AI Core provides a massive leap forward in reconfigurable and customizable processing performance for Space mission deployment of compute intensive applications such as Signal Processing and Machine Learning. The platform is designed to accept components suitable for Space 2.0 level missions with limited radiation environment or mission length, such as LEO applications. The standard manufacturing build of this platform is however intended for laboratory prototyping use only with commercial footprint compatible parts and unqualified space parts fitted in most cases.

The primary customers will be using this version for design proving and other prototype level testing. Custom manufacture of the board with qualified space plastic parts, and possible application specific customizations is available as an option to customers.

The board features a reference Space Grade power supply co-designed with Texas Instruments, along with many other Space Enhanced Plastic devices covering clocking and system monitoring functionality. The board also features Space Grade DDR4 Memory modules from Teledyne-e2v and QSPI configuration flash from Infineon Technologies.

See the ADK-VA600 page for the complete system overview.

Specification

Board Format

6U VPX (233mm x 160mm x 12.5mm)

Environmental Specifications

Temperature Limits

		Operating Temperature Range		Storage Temperature Range
		Min	Max	Min	Max
AC1	Air Cooled Industrial	-40°C	+70°C	-55°C	+100°C

Operating Humidity Range:
Up to 95% (non-condensing)

EMC:
FCC 47CFR Part 2
EN55022:2010 Equipment ClassB

Host I/F

n/a

Target Device

AMD-Xilinx Versal AI Core
XCVC1902-1MSIVSVA2197 (default), XQRVC1902-1MSBVSVA2197 (option)

FPGA Resources

Chosen Device	FFs	LUTs	DSPs	BRAM	URAM
XCVC1902-1MSIVSVA2197 (default)		899K	1968	34Mb	130Mb
XQRVC1902-1MSBVSVA2197		899K	1968

FPGA Hard IP Cores

400x AI Engine Tiles
2x ARM Cortex-A72 MPCore™
2x ARM Cortex-R5 MPCore
4x PCI Express Gen3 cores

On Board Memory

Memory Type	No. Banks	Memory Size (per bank)
MCP	2	8GB (1G @ 72bits wide) DDR4

Target FPGA Configuration

Via QSPI Flash (or RAD Tolerant options) on daughter module, uSD and via JTAG

FPGA Configuration Flash

Flash Type	Flash Size
1Gb QSPI - on a daughter module - upgradeable to RAD Tolerant Flash or a VCK190 Xilinx Flash module.,

I/O Interfaces

Interface Type	Qty	Description
FMC+ I/O (FMC+)
HSSIO	24	24x HSSIO up to 32G via FMC+ module
BACKPLANE I/O (VPX Backplane)
HSSIO	20	20x HSSIO up to 10G via VPX Backplane
I2C	1	I2C for System Monitor
JTAG	1	JTAG for System Monitoring, configuration and testing

Ordering Information

Ordering Code
ADM-VA600(T)
Parameter	Code	Parameter Description
Platform Type	T	/DEV - ADM-VA600/DEV - with XCVC1902 fitted, purchasable as part of ADK-VA600 Development Kit, /CC4 - build to order with Space Qualified Components, /C(x) - build to order with Customer Specific Modifications

Resources

Support

Please visit the ADK-VA600 product page for details on resources supplied for the ADM-VA600.